ITW Devcon Solid Adhesive, 500 g
Brand:
ITW Devcon
MFR Code:
691-173
ITW Devcon Solid Adhesive, 500 g
| ITW Devcon
Technical Specifications
| Adhesive Type | Epoxy Adhesive |
| Application | Industrial |
| Material Compatibility | Metal, Steel |
| Colour | Grey |
| Product Form | Solid |
| Package Type | Can |
| Package Size | 500 g |
| Cure Time | 16 h |
| Shear Strength | 14 N/mm² |
| Maximum Operating Temperature | +93°C |
| Specific Gravity | 2.2 |
| Operating Temperature Range | → +93 °C |