ITW Devcon Solid Adhesive, 500 g
Brand:
ITW Devcon
MFR Code:
691-189
ITW Devcon Solid Adhesive, 500 g
| ITW Devcon
Technical Specifications
| Adhesive Type | Epoxy Adhesive |
| Application | Industrial |
| Material Compatibility | Stainless Steel |
| Colour | Grey |
| Product Form | Solid |
| Package Type | Can |
| Package Size | 500 g |
| Cure Time | 16 h |
| Shear Strength | 16 MPa |
| Maximum Operating Temperature | +121°C |
| Specific Gravity | 2.24 |
| Operating Temperature Range | → +121 °C |
| Setting Time | 58min |