Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm
Brand:
Bergquist
MFR Code:
SPK4-0.006-00-104
Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm
| Bergquist
Technical Specifications
| Dimensions | 25.4 x 19mm |
| Thickness | 0.152mm |
| Length | 25.4mm |
| Width | 19mm |
| Thermal Conductivity | 0.9W/m·K |
| Material | Thin Film Polyimide |
| Minimum Operating Temperature | -60°C |
| Maximum Operating Temperature | +180°C |
| Hardness | Shore A 90 |
| Material Trade Name | Sil-Pad K4 |
| Operating Temperature Range | -60 → +180 °C |