Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 28.96 x 20.57mm
Brand:
Bergquist
MFR Code:
SPK4-0.006-AC-122
Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 28.96 x 20.57mm
| Bergquist
Technical Specifications
| Dimensions | 28.96 x 20.57mm |
| Thickness | 0.152mm |
| Length | 28.96mm |
| Width | 20.57mm |
| Thermal Conductivity | 0.9W/m·K |
| Material | Thin Film Polyimide |
| Self-Adhesive | Yes |
| Minimum Operating Temperature | -60°C |
| Maximum Operating Temperature | +180°C |
| Hardness | Shore A 90 |
| Material Trade Name | Sil-Pad K4 |
| Operating Temperature Range | -60 → +180 °C |