Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm
Brand:
Bergquist
MFR Code:
HF625-0.005-AC-104
Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm
| Bergquist
Technical Specifications
| Dimensions | 25 x 19mm |
| Thickness | 0.127mm |
| Length | 25mm |
| Width | 19mm |
| Thermal Conductivity | 0.5W/m·K |
| Material | Hi-Flow 625 |
| Self-Adhesive | Yes |
| Minimum Operating Temperature | -30°C |
| Maximum Operating Temperature | +150°C |
| Material Trade Name | Hi-Flow 625 |
| Operating Temperature Range | -30 → +150 °C |