Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Brand:
Bergquist
MFR Code:
HF650P-0.001-01-00-54
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
| Bergquist
Technical Specifications
| Thickness | 0.001in |
| Thermal Conductivity | 1.5W/m·K |
| Material | Hi-Flow 650P |
| Self-Adhesive | Yes |
| Minimum Operating Temperature | -40°C |
| Maximum Operating Temperature | +150°C |
| Material Trade Name | Hi-Flow 650P |
| Operating Temperature Range | -40 → +150 °C |